What are the integrated circuit packaging equipment?

Integrated circuit packaging equipment includes diluent, wire bonder, mounter, dicing/cutting machine, sealing machine and mounter. According to relevant data, the thinning machine thins the wafer substrate by thinning/grinding to improve the heat dissipation effect of the chip, and thinning to a certain thickness is beneficial to the later packaging process. The dicing machine is a laser dicing machine, which uses high-energy laser beam to irradiate the surface of the workpiece, so that the irradiated area is partially melted and gasified, thus achieving the purpose of dicing.