With the development of microelectronics technology and assembly technology, modern electronic devices are increasingly becoming highly integrated systems formed by high-density assembly and micro-assembly. The increasing heat flow density of electronic devices makes designers face the severe challenge of thermal control in the structural design phase of products. Improper thermal design is an important cause of failure of modern electronic products, the life of electronic components and their operating temperatures have a direct relationship, it is the device and PCB thermal cycling and temperature gradients generate thermal stress and thermal deformation ultimately leading to fatigue failure. The traditional empirical design and prototype thermal test method has not been adapted to the rapid development of modern electronic equipment, optimization of the design of the new needs. Therefore, it is of great practical value to learn and understand the latest thermal design and thermal analysis methods of electronic devices to improve the thermal reliability of electronic devices.
Organizer: Wisdom Training Information Network 0755-26506757 13798472936
Training Benefits: - Through the study of this course, the students will be able to understand --- 1. the thermal design requirements of electronic equipment and thermal design methods 2. the choice of cooling methods for electronic equipment and the thermal characteristics of the main components 3. the natural cooling of the electronic equipment and the design of forced air cooling 4. the design and optimization of heat sinks. 4. the design and optimization of heat sinks 5. the principles and applications of thermoelectric cooling, heat pipe heat sinks and other efficient heat dissipation components 6. the evaluation of the thermal performance of electronic equipment and improvement methods 7. the principles of computer-aided thermal analysis 8. examples of thermal design engineering applications for electronic equipment Target Trainees: - Thermal designers of research institutes and companies, structural reliability designers Training Duration: 2 days, ****14 hours Thermal Design of Electronic Equipment Course Content: I. Requirements for Thermal Design of Electronic Equipment (0.5H) 1. Basic Requirements for Thermal Design 2. Issues to be Considered in Thermal Design II. Thermal Analysis Methods for Electronic Equipment (1H) 1. Basic Issues in Thermal Analysis 2. Basic Criteria for Heat Transfer 3. Calculation of Heat Exchanges 4. Thermo-electric Simulation 5. Steps in Thermal Design III. Selection of Cooling Methods (0.25H) 1. Classification of Cooling Methods 2. 3. Examples of cooling method selection 4. Limits of cooling techniques IV. Thermal Characteristics of Electronic Components (0.25H) 1. Thermal characteristics of semiconductor devices 2. Thermal characteristics of magnetic core elements 3. Thermal characteristics of resistors 4. Thermal characteristics of capacitors V. Design of Natural Cooling for Electronic Devices (1H) 1. Thermal Mounting Techniques 2. Thermal Shielding and Thermal Isolation 3. Design of Natural Cooling for Printed Circuits 4. Conduction Cooling 5. Design of cabinets and enclosures for electronic equipment VI. Ribbed radiator for electronic equipment (0.5H) 1. general 2. heat transfer performance of ribbed radiator 3. design of ribbed radiator 4. some problems in engineering applications of ribbed radiator VII. Forced-air cooling design for electronic equipment (1H) 1. thermal calculation of forced-air cooling 2. ventilator 3. pressure loss and calculation of the system 4. design of forced-air cooling system 5. design of ventilation ducts 6. design of ventilation ducts 7. design of forced air cooling system (1H) 1. thermal calculation of forced-air cooling 2. ventilator 3. system pressure loss and calculation 4. design of forced-air cooling system Design of forced-air cooling system 5. design of ventilation pipes 6. design of chassis and cabinets for forced-air cooling VIII. design of cold plate for electronic equipment (0.5H) 1. overview 2. structural types of cold plate and principles of selection 3. calculation of heat exchange of the cold plate 4. design steps of the cold plate IX. thermoelectric cooler (1.25H) 1. overview 2. basic principles of thermoelectric refrigeration 3. basic equations of net heat absorption of the cold end of the cooler 4. two methods of designing thermoelectric coolers 5. Two design methods of thermoelectric cooler 5. performance of multi-stage thermoelectric cooler 6. example of engineering design of thermoelectric cooler 7. structural design of thermoelectric cooler 8. application of thermoelectric cooler in thermal control X. Design of heat pipe radiator (1.25H) 1. overview 2. types of heat pipes and their working principle 3. heat transfer performance of common heat pipes 4. heat pipe design XI. Evaluation of thermal performance of electronic equipment (0.5H) 1. thermal performance evaluation (0.5H) (0.5H) 1. purpose and content of thermal performance evaluation 2. thermal performance sketch 3. thermal performance check items 4. thermal performance measurement XII. computer-aided thermal analysis techniques (1.5H) 1. overview of computational fluid dynamics (CFD) 2. working steps of CFD 3. branches of CFD 4. CFD solution process 5. structure of CFD software 6. commonly used CFD software in commercial use 7. application of boundary conditions XIII. thermal design examples (0.25H) 1. overview 2. types of heat pipes and their working principles 3. heat transfer performance of ordinary heat pipes 4. heat pipe design XI. thermal design of electronic devices (0.5H) Thermal Design Examples (4H) 1. Thermal Design of High Power LED 2. Thermal Analysis Software Application for Electronic Devices 3. Thermal Design of Typical Sealed Electronic Devices 4. Thermal Design of Power Devices and Optimization of Heat Sinks 5. Thermal Design of Surface Mount Components 6. Thermal Simulation and Optimization of a 3G Mobile Base Station Cabinet 7. Current State of the Art and Progress of Heat Pipe Radiator Technology for Electronic Devices 8. Fan Outlet and Radiator when Blowing Cooling Effect of distance between fan outlet and heat sink on module heat dissipation 9. Experimental evaluation of thermal design software