SMI - a leading semiconductor company specializing in the development and production of Pressure Sensors based on MEMS technology.
Founded in 1991 and headquartered in the U.S. with state-of-the-art quality and production controls, SMI produces sensor products that provide excellent solutions for applications requiring ultra-low pressure ranges, extreme operating environments, and tiny footprints for the automotive, medical, and industrial markets.
For OEM and customized products, SMI offers a wide range of pressure sensor dielectrics from ultra-low voltage to dielectric resistant high pressure in both gauge and absolute configurations, as well as back-inserted absolute pressure dielectrics with pressure ranges from 0.05PSI (~4mbar) to 300PSI (~21bar) for more demanding applications.
Integrated Circuit Chip Packaging Overview:
Narrow sense: the use of film technology and microfabrication technology, the chip and other elements in the frame or substrate. Layout, paste fixing and connection, lead out terminals and through the plastic insulating medium potting fixed, constituting the overall three-dimensional structure of the process.
Broad: the package body and the substrate connection and fixation, assembly into a complete system or electronic equipment, and to ensure that the whole system comprehensive performance engineering.