FPC flexible circuit board production process and procedure?

Main Material: Copper Foil Protective Film (Polyester Imide)

Auxiliary Material: Reinforcement PSA (3M966) Text Ink

Process Flow: Opening (Copper Foil Protective Film Reinforcement PSA) - Drilling (Copper Foil Protective Film Reinforcement PSA) - Black Holes or PTH - Applying Dry Film - Films

Lin Alignment - Exposure -Black hole or PTH -Dry film -Film

Lin alignment -Exposure -Developing - Copper plating - Removing dry film - Chemical cleaning - Applying dry film - film alignment - exposure - development - etching

engraving -Dry film removal -Brushing -Upper/lower protective film -Lamination -Patch -Lamination -Punch -Imprint text -Baking -Surface treatment

Conditioning -Laminating PSA -Dividing- -Punching Leads - Electrical Inspection - Punching Shapes - FQC (Full Inspection) -OQC - Packaging - Shipment