In the field of core, China is in a weak position, many chips need to rely on imports, long-term constraints, the lack of independent intellectual property rights and upstream and downstream industry chain. In recent years, the U.S. and China trade war, the U.S. on the chip issue of sanctions against China, so that we realize the importance of the chip. After that, the domestic technology related to the difficulties of chip manufacturing has been conquered one after another.
China's information industry technology in many areas of positive progress
Information industry technology breakthroughs, with the field of 6G communication technology, China has stood at the top. Become the main source of 6G technology patent applications, ranking first in the world.
Soon our country will also have the ability to manufacture high-end chips, and I believe that under the continuous accumulation of our innovative technology, the mass production of 7nm chips will soon be realized. This will allow us to stop the development of cell phones, cars, and other technology companies because of the chip problem.
What is the role of the laser cutter in chip manufacturing?
In chip manufacturing, wafers as the core raw materials of the chip, laser cutting machine can be very good to meet the wafer cutting, can effectively avoid the problem of grinding wheel scratching
1, non-contact processing: laser processing only laser beam and processing parts in contact, there is no cutting force used for the cutting parts, to avoid the processing of the surface of the material to cause damage.
2, high processing precision, small thermal impact: pulsed laser can do instantaneous power is very high, high energy density and low average power, can instantly complete the processing and the thermal impact area is very small, to ensure high-precision processing, small thermal impact area.
3, high processing efficiency, good economic benefits: laser processing efficiency is often several times the effect of mechanical processing and no consumables without pollution. Semiconductor wafer laser invisible cutting technology is a new laser cutting process, with fast cutting speed, cutting does not produce dust, no cutting substrate depletion, the required cutting channel is small, completely dry process and many other advantages.
The main principle of laser cutting is to focus a short-pulse laser beam through the surface of the material in the middle of the material, forming a calcium layer in the middle of the material, and then externally applying pressure to separate the chips.