Semi-automatic wafer mounter is composed of CHUCK TABLE, MOUNTING, FRAME CUTTER, WIND&REWIND, COVER, ELECTRICAL CONTROL SYSTEM and other parts.
The equipment has the following characteristics:
One, the position of the straight line cutting knife can be automatically changed according to different FRAME, which can effectively save the film. After each straight line cutting, the back of the film by the vacuum suction cup, suck up.
Two, WAFER CHUCK and FRAME CHUCK is separated, WAFER CHUCK can be adjusted up and down, so that you can reasonably deal with different thicknesses of WAFER, the overall CHUCK TABLE there is floating, so that when the film, the WAFER has a protective effect.
Three, the film mechanism, MOUNTING roller is controlled by the cylinder, the size of the cylinder force can be adjusted artificially, so that the size of the film force can be determined according to customer product requirements.
Four, the machine on the pneumatic components using SMC or KOGANEL brand. Guarantee its quality and service life. Mechanical aspects of the machine purchased parts to high-quality brand-name products
Fifth, rotary cutting knife in 6.8-inch conversion, convenient, easy to operate in addition to cutting, while cutting stable.
6, the feeding mechanism, film loading and unloading, relatively convenient, as long as a few turns of the tension screw, you can realize the operation of the upper and lower material. At the same time, there is a line on the barrel, which is easy to determine the position of the film after loading.
Seven, this equipment is TABLE mobile, the product is put on the TABLE, TABLE in the servo motor drive into the working position, the film roller will be pressed down the film (pressed to the FRAME), TABLE and then move out, so that the film is automatically affixed to the product.