smt's basic process includes solder paste printing, parts placement, reflow soldering, AOI optical inspection, maintenance of sub-panel and so on, for the pursuit of miniaturization of electronic products, the past perforated plug-in components have not been able to shrink, and smt SMD assembly of high density, small size and light weight products, small electronic products can only be used in the surface mount original.
smt SMD process can be divided into single-sided assembly, double-sided assembly, single-sided mixed process, double-sided mixed process, double-sided assembly process *** five kinds of process, which single-sided assembly process on the incoming material detection, silk screen Hum paste, patch drying, reflow soldering, welding is completed, but also need to be cleaned on the SMD components, and finally for testing and rework and so on.