other concept stocks of packaging and testing include:
Shenzhen Technology: the company belongs to the electronic information manufacturing service (EMS) industry, providing customers with high-quality R&D and manufacturing services for electronic products. The company's main business includes providing advanced manufacturing services for computers and storage, solid-state storage, communications, consumer electronics, medical devices and other electronic products, as well as R&D and production of metering systems, automation equipment and semiconductor packaging and testing services.
huatian technology: in July 218, it was announced that the company planned to invest in the construction of Nanjing integrated circuit advanced packaging and testing industrial base project in Nanjing Pukou Economic Development Zone.
hanwei technology: quarterly announcement in 22; The MEMS product line has been put into production smoothly, and the company has mastered the core chip design technology, and is preparing to build a MEMS sealing and testing production line, effectively opening up the technical and market channels for product upgrading.
shuobeide: made great efforts in the manufacturing of fingerprint identification module and chip sealing and testing. In 214, the company successively controlled Sunlight Electric, Kunshan Kaier and newly established Huizhou Kaier to quickly cut into the fields of sensor packaging, molding and manufacturing; Industry leader in antenna field.
Guangli Technology: mainly engaged in safety production monitoring, energy saving and environmental protection business, and semiconductor packaging and testing equipment manufacturing business; As a private enterprise supporting military industry, Changshu yabang, a wholly-owned subsidiary, is the main supplier of domestic military engineering equipment (pontoon bridge electronic control system and training simulator) at present, and its main customers are the general assembly units of Chinese military engineering equipment (pontoon bridge).
liande equipment: in April 22, the company plans to issue shares to build a semiconductor packaging and testing intelligent equipment construction project.
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