Recently, relevant Chinese authorities issued a notice agreeing to start the construction of my country’s national computing power hub in eight provinces and regions including the Yangtze River Delta, Beijing-Tianjin-Hebei, Guangdong-Hong Kong-Macao Greater Bay Area, Inner Mongolia, Ningxia, Gansu, Chengdu-Chongqing, and Guizhou. Node planning and implementation planning for ten national data center clusters. Among them, the "Eastern Digital and Western Countermeasures" project has been fully launched, which will promote the development of the semiconductor chip industry chain from short, medium and long stages.
First, data center-related chips are the first to benefit in the short term. Stimulated by “digitizing from the east to the west”, the first industry to benefit is the data center-related chip industry. Data centers can be divided into three main elements, namely storage, computing power and network. First, memory chips are the main carrier of data. In the current environment of rapid growth in data volume, the performance requirements and quantity of memory chips have increased significantly. Second, in terms of server chips, due to the explosion of demand for current data processing in the downstream application industry growth, and directly stimulates the rapid development of GPU, CPU, XPU, FPGA and other related computing chips; thirdly, the memory interface chip is the core part of the CPU to access memory data, and its function is to improve the stability and speed of memory data access. To match CPU performance and running speed.
Second, it will stimulate the development of the data transmission-related chip market in the medium term. A large amount of data in the eastern region needs to be stably transmitted to the western region for storage and technology, which often faces the problem of data delay in long-distance communication transmission. Therefore, "digital data in the east and calculation in the west" need to further consolidate the network communication infrastructure. To this end, data and data Transmission-related communication chips will usher in greater development.
Third, chips related to data generation will maintain high prosperity in the long run. "Data from the East and Computing from the West" has alleviated the shortage of land and energy in the eastern region, greatly reduced the cost of computing power, and thus promoted the massive generation of data traffic in downstream application fields. As applications in areas such as autonomous driving and metaverse/AR/VR are implemented one after another, the demand for chips related to data generation will remain rapid.
The company is committed to the research, development, production and sales of semiconductor special equipment. Its products mainly include single-chip wet equipment and photolithography process glue coating and development equipment. Its single-chip wet equipment mainly includes Glue machines, cleaning machines and wet etching machines, etc.; photolithography process glue coating and development equipment mainly includes developing machines/gluing machines, glue spraying machines, etc. Mainly used in single wafer processing of 8/12 inches, 6 inches and below.
The company is mainly engaged in the design and sales of non-volatile memory chips. Its products mainly include two major types of non-volatile memory chips, EEPROM and NOR Flash, which are mainly used in computers, mobile phones, home appliances, and network communications. , automotive electronics, industrial control, Internet of Things and wearable devices and other fields.
The company is my country's leader in RF front-end chips and a key brand of RF switches and RF low-noise amplifiers for smartphones in my country. Committed to the R&D and sales of radio frequency front-end chips, it mainly provides radio frequency front-end chip products and IP licensing to the market. The main application areas of its products are mobile smart terminals.
The company is my country's leading enterprise in MEMS packaging and CMOS image sensors. It is committed to the packaging and testing of integrated circuits. Its business is mainly for ambient light sensing chips, image sensing chips, biometric identification chips, and micro-controllers. Providing wafer-level chip size packaging and testing services for electromechanical systems, light-emitting electronic devices, etc.