1. test machine (Test Handler): used to test and classify the chip, usually including test head, probe card and robotic arm and other components.
2. Soldering machine (Wire Bonder): used to connect the chip to the pins of the package device, usually using gold or copper wire for connection.
3. Packaging machine (Die Bonder): used to paste the chip to the substrate of the package device, and connect the pins and circuitry, usually including suction nozzle, robotic arm and optical sensors and other components.
4. Soldering Machine (Soldering Machine): used to weld the pins and circuits of the encapsulated device, usually using hot air, infrared or laser welding methods.
5. Package test equipment (Package Tester): used to test the performance and reliability of the package device, usually including electrical testing, reliability testing and environmental testing.
6. Chip sorting machine (Wafer Sorter): used for rapid sorting and classification of chips, usually through optical sensors or robotic arm operation.
7. Thermal Press: Used to press the encapsulated device and substrate together, usually using high temperature and high pressure to press.
8.