2, heating the soldering iron will be in contact with the soldering point, pay attention to the first to keep the iron to heat the various parts of the weldment, such as printed circuit boards on the leads and pads so that it is heated, and secondly pay attention to make the head of the soldering iron flat part (the larger part of the) contact with the larger capacity of the weldment, the head of the iron, the side or edge of the part of the soldering iron Contact the smaller heat capacity of the soldering iron head, in order to keep the solder evenly heated;
3, melt the solder when the solder heated to the temperature that can melt the solder will be placed in the soldering point of the wire, the solder began to melt and wet the soldering point;
4, move away from the solder when a certain amount of melted solder will be moved away from the soldering wire;
5, move away from the iron when the solder is completely wetted the soldering point after the iron is moved away from the soldering iron, note that the direction of moving away from the iron should be The direction of removing the soldering iron should be roughly 45 ° direction.