DIP package, is the abbreviation of dual inline-pin package, also known as dual inline package technology, dual inline package, DRAM a component package form. Dual inline-pin package refers to the use of dual inline-pin packages for integrated circuits, the vast majority of small and medium-sized integrated circuits are used in this form of packaging, and the number of pins is generally not more than 100.
(DIP package)
Expanded informationDIP package use:
The use of this package of chips with two rows of pins, which can be directly soldered to the DIP structure of the chip socket or soldered in the same solder holes. It is characterized by easy PCB through-hole soldering and good compatibility with motherboards. However, due to the package area and thickness are relatively large, and the pin in the insertion and removal process is easily damaged, the reliability is poor.
At the same time, this type of package is affected by the process, the pins are generally not more than 100. With the high degree of integration within the CPU, the DIP package quickly exits the stage of history. Only in the old VGA/SVGA cards or BIOS chips can you see their "footprint".
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