1. Integration: Power modules integrate one or more power semiconductor devices, such as IGBTs, MOSFETs, diodes, and power integrated circuits, as well as the necessary control circuits, heat dissipation equipment, and so on. These components are usually mounted in a compact package.
2. Power Conversion: Power modules are typically used in power conversion applications such as DC-AC inverters, AC-DC rectifiers, AC motor drives, etc. The goal of these modules is to convert power from one form to another while minimizing energy loss.
3. Control and drive circuits: Power modules typically include control and drive circuits to manage the on-off state of power semiconductor devices. These circuits are responsible for generating the appropriate trigger signals to ensure that the semiconductor devices are turned on and off at the proper times.
4. Heat dissipation: Since power modules generate a lot of heat, they usually include heat dissipation devices such as aluminum substrates, heat sinks, or heatsinks to dissipate the heat to ensure that the devices operate within a safe temperature range.
5. Encapsulation: Power module packages are usually compact, protective enclosures that isolate the internal circuitry and provide mechanical protection.
6. Applications: Power modules can be used in a variety of applications, including industrial automation, electric vehicles, solar inverters, wind energy converters, medical devices, and more. They provide efficient power conversion and control in these applications.
Operating principles and performance characteristics vary with different types of power modules. Different power modules can include different types of power semiconductor devices, such as IGBTs, MOSFETs or SiC MOSFETs, to meet the needs of different applications. Designing and selecting the appropriate power module requires consideration of circuit topology, current and voltage requirements, heat dissipation needs, and available control circuitry.