The meaning of lds is Laser Direct Structuring. It is a 3D-MID "Three-dimensionalmouldedinterconnectdevice" production technology that specializes in laser processing, injection molding, and electroplating processes.
The principle is to combine the electrical interconnection function of ordinary plastic components/circuit boards, the function of supporting components, the function of supporting and protecting plastic shells, and the function of shielding and antennae generated by combining mechanical entities and conductive graphics to form the so-called 3D-MID, which is applicable to ICSubstrate, HDIPCB, LeadFrame and other localized products. The 3D-MID is suitable for ICSubstrate, HDIPCB, and LeadFrame localization.
Advantages:
1. Low cost of ownership.
2, easy to modify in the development process.
3, plastic components plating does not affect the characteristics of the antenna and stability.
4, the product volume and then reduced, in line with the development trend of thin cell phone.
5. Increased production capacity.
6. Short design development time.
7. Customized design according to customer needs.
8. Available for laser drilling.
9. Compatible with SMT process.
10. No need for optical mask.